Renesas RZ/A2M Evaluation Board
ARM Cortex-A9 @ 528 MHz

M13design RZ/A2M-EK is a complete evaluation and development platform for the Renesas Electronics® based RZ/A2M Cortex®-A9 R7S921043VCBG microprocessor. The full range of the hardware features on the board helps users to quickly evaluate all the available peripherals (10/100-Mbit Ethernet, microSDTM card, USB host/device, Audio codec with 4-pole Jack, SDRAM, HyperRAM™ and HyperFlash™, Quad-SPI Flash memory, 4.3-inch colour LCD-TFT with capacitive touch panel, and many others) and to develop their custom applications. PMOD™ and mikroBUS™ connectors make it possible to easily extent the boards features (Sensors, communication and network modules and many more). The integrated JLink-OB debug probe provides in-circuit debug and programming for the RZ/A2M device and also a built-in VCOM functionality.

Main Features


  • Renesas RZ/A2M MPU | R7S921053VCBG
  • ARM Cortex-A9 Core @ 528 MHz
  • 324 pins, 0.8mm-pitch BGA package
  • 4 Mbyte Internal RAM


  • 32 Mbyte External RAM
  • 64 Mbyte External Serial Flash
  • 8 Mbyte OctaRAM
  • 16 Kbit I2C EEPROM
  • microSD Card Interface


  • 4.3-inch 800x480 TFT LCD
  • Capacitive Touch Panel
  • MIPI-CSI2 Camera Interface
  • 8/10-bit Camera Interface


  • Ethernet (RMII and PHY)
  • 2 x USB Connector (Host/Device)


  • Onboard Debugger J-Link-OB™ (SWD/JTAG)
  • Virtual COM Port


  • Audio Codec with 4 pole 3.5mm Headphone Connector
  • 3-axis Accelerometer
  • 1 x User LED
  • 2 x User Switch
  • 1 x Reset Switch


  • 2 x Digilent PMOD™ Interface
  • 1 x mikroBUS™ Interface

Ordering Information

Part NumberDescriptionIn StockUnit PriceBuy
M13-RZ/A2M-EKRZ/A2M Evaluation Kit349.00 EUR

All sales related inquiries (webshop, custom quotation) are handled by our sales partner Cynetis Embedded.


Document TitleDescriptionFormatSizeDate
M13-RZ/A2M-EK DatasheetDatasheetPDF348 KBMar. 29, 2021
M13-RZ/A2M-EK User ManualUser ManualPDF2.8 MBApr. 06, 2021
M13-RZ/A2M-EK SchematicSchematicPDF269 KBApr. 02, 2021
M13-RZ/A2M-EK PCB LayoutPCB LayoutPDF4.0 MBDec. 01, 2020
M13-RZ/A2M-EK BOMBill of MaterialXLSX24 KBDec. 01, 2020


Document TitleDescriptionFormatSizeDate
M13-RZ/A2M-EK BSP DemoBSP project which demonstrates the use of the board's LCD and touchscreen, accelerometer and ledZIP1.7 MBAug. 6, 2021
M13-RZ/A2M-EK BSP Demo Application NoteApplication Note for bsp_demo projectPDF1.2 MBAug. 6, 2021
Guiliani RA SDK With M13-RZA2M-EKLink to Guiliani SDK With M13-RZA2M-EK Evaluation Board KitLinkN/AMar. 24 2023

Hardware Partners

RenesasMCU & MPU, Power deviceRenesas provides for the M13-RZ/A2M-EK board the R7S921053VCBG (RZ/A2M Cortex-A9 MPU) and the DC/DC devices for generating the 3.3V, 1.8V and 1.2V power rails. Respectively the ISL80030AFRZ-T7A and the ISL80020AFRZ-T7A. Renesas also provides the Backlight driver ISL88002IH29Z-TK for the on-board LCD.
Wurth ElectronikConnectors, IC, InductorsWurth Elektronik provides most of the connectors on the M13-RZ/A2M-EK board as listed thereafter : The USB connectors, the RJ45, the SD Card, all the FFC/FPC connectors and all the male and female pinheaders. They also provide the 32.678KHz, 24Mhz, 25MHz crystals and the 13Mhz oscillator. In addition, the board is equiped with Wurth Electronik latest accelerometer, the WSEN-ITDS 3-Axis Acceleration Sensor.


Debug ProbesSEGGER provide for this board their "On Board" Debugger the J-link OB used for JTAG and SWD communication. A Virtual COM is also available through this hardware feature.

Software Partners

Oryx EmbeddedTCP/IP stack, SSL/TLS & SSH encryptionOryx Embedded offers a complete range of networking solutions for embedded systems, making the Internet of Things a reality. Their portfolio includes professional-grade TCP/IP components as well as SSL/TLS & SSH encryption to make your communications safe and secure.
GuilianiGraphical User Interface Framework for embedded systemsTES Electronic Solutions GmbH is an innovative technology and design services company offering intellectual properties (IP), embedded hard- and software for a vast range of customers in global markets, such as in industrial, automotive, consumer electronics, as well as in semiconductors. Key capabilities include embedded software, graphics, RF & antenna, radar, mixed-signal and digital ASIC and FPGA designs.